STYRL Laser
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Key Advantages:
- Use of multi-band hybrid light source, closer to mercury lamp spectrum.
- High production capacity suitable for mass production environments.
- Window opening accuracy options of 60µm and 50μm.
| Maximum Substrate Size | 610mm×630mm |
| Substrate Thickness | 0.1mm~3mm |
| Process Analysis | 35μm/50μm |
| Outer Alignment Accuracy | ±6μm |
| Production Efficiency | 1.3 side/min @500mj/cm² |
| Stand-alone Dimensions | 2940mm×1700mm×2195mm |
Enhanced Performance:
- Specialized for high-capacity production needs.
- Multi-band hybrid light source for stringent ink curing requirements.
- Optimized for carrier board manufacturing accuracy.
| Maximum Substrate Size | 623mm×730mm |
| Process Analysis | 40μm/60μm |
| Line Width Uniformity | ±10% |
| Energy Uniformity | ≥95% |
| Production Efficiency | 2.5 face/min @500mj/cm² |
| Automatic Wire Size | 6380mm×3082mm×2455mm |
Mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products.
Primary Product Range: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Annealing Machine, and Automatic Dicing Saw Machines.
