Basic Specifications

Product Overview

As a series of laser marking machines, the UV laser marking machine is researched and developed with a 355nm UV laser. The machine adopts intracavity frequency doubling technology, ensuring the focused spot is extremely small. Compared with infrared lasers, the mechanical deformation and heat-affected zones of the workpiece are minimized.

This UV laser marking technology utilizes international advanced standards. High-energy ultraviolet photons directly destroy the molecular bonds on the surface of non-metal materials, causing molecules to separate from the object. This method has almost no thermal influence, famously known as "cold processing," making it ideal for special materials, ultra-fine marking, and precision engraving.

Key Product Features

• Capable of marking characters as small as 0.1mm height and penetrating 10um micropores.
• Excellent marking and coloring effects, especially on high polymer materials and plastics difficult for infrared lasers.
• Zero residue, no carbonization, and no deformation during processing; ensures a smooth finished surface.
• Equipped with a closed safety cover, meeting environmental and export safety standards.

Industrial Applications

• Electronic products and logo marking.
• Mobile accessories and computer fittings.
• Food industry, PVC pipes, and pharmaceutical packaging (HDPE/PO/PP).
• Flexible PCB marking and coating removal from various surfaces.
• Micropore processing in silicon wafers and fire-proof material marking.

Technical Parameters

Marking Samples & Production

Packing & Shipping

Internal: Anti-collision foam + wrapping film.

External: Export standard wooden cases for maximum protection.

Frequently Asked Questions