The UV Laser Marking Machine is developed using a 355nm UV laser, which adopts third-order intracavity frequency doubling technology. Compared with infrared lasers, the focused spot of 355nm UV light is smaller, which can greatly reduce the mechanical deformation of materials and has small thermal impact. Therefore, the UV laser marking machine is mainly used for ultra-fine marking and engraving.

It is especially suitable for application fields such as marking on food and pharmaceutical packaging materials, micro-hole drilling, high-speed dicing of glass materials, and complex pattern cutting on silicon wafers. The system is widely applied in 3C manufacturing, mobile digital products, auto parts, hardware, electronic appliances, and automated precision processing.