The UV laser marking machine belongs to the advanced series of laser marking technology, specifically developed using a 355nm UV laser generator. By adopting three-order intracavity frequency multiplication technology, the 355nm UV focusing facula is significantly smaller than infrared lasers. This precision greatly reduces mechanical deformation of materials and minimizes heat influence during processing.
It is primarily utilized for ultra-fine marking and engraving, making it exceptionally suitable for food and medical packaging materials, micropores, high-speed division of glass materials, and silicon wafer complex graphics.
| Technical Specifications | |
|---|---|
| Laser Wavelength | ND: YVO4/355nm |
| Output Power | 1.5W / 2W / 3W / 5W / 8W (Customizable) |
| Beam Quality | M2 < 1.2 |
| Laser Frequency | 20~200 KHz |
| Marking Area | 70*70mm / 110*110mm / 175*175mm |
| Marking Speed | ≤ 9000mm/s |
| Min. Line Width | ≤ 0.01mm |
| Repeated Precision | ±0.003mm |
| Cooling Mode | Air or Water Cooling |
| Power Input | AC 220V (±10%) / 50Hz |
Free Sampling: To determine if this machinery is the right tool for your specific application, free sampling services are provided for your materials using in-house artwork facilities.
Packing: Anti-collision foam + wrapping film + Export standard wooden case.
Shipping: Main transportation by sea; air or railway options available.