High-Precision Green and UV Laser Marking System for Semiconductor Wafers

Customization:	Available
After-sales Service:	Provided
Warranty:	12 Months

Basic Information

Model NO.

HDZ-WAF500

Laser Visibility

Visible

Applicable Material

Metal, Wafer

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Laser Wavelength

UV Laser, CO2 Laser, Green Laser

Marking Method

Scanning Marking

Product Name

PCBA & IC & Wafer Marking Machine

Product Description

Green Laser/UV Laser Wafer Marking Machine for 6-Inch/8-Inch /12-Inch

■Brief Description

Applicable for the 6-inch, 8-inch and 12-inch wafer marking with high precision and efficiency.

★Key Features

✔

Advanced Laser Technology: Utilizes green laser or UV laser for fine focusing spots and non-contact marking.

✔

High Automation: Fully-automatic loading and unloading with automatic edge searching for maximum efficiency.

✔

User-Friendly Interface: Computer-controlled system on Windows platform with an English interface and self-developed software.

✔

Safety System: Includes an automatic fault alarm function for safe and reliable operation.

✔

Precision Marking: Delivers extremely precise marking to the product DIE.

Technical Specifications

Parameter	HDZ-WAF500	HDZ-WAF600
Laser type	Fiber laser, CO2 (optional)	UV, green light (optional)
Laser power	Fiber 20W, CO2 10W	UV 7W, green light 10W
Cooling mode	Air cooling	Water cooling
Repeat Positioning Precision	±0.2mm	±0.05mm
Processing Wafer Size	2 inch, 4 inch, 6 inch	6 inch, 8 inch, 12 inch
Power supply	220V, 50Hz	220V, 50Hz
Dimensions (Ref.)	90011501700mm	195016501635mm

Product Application & Range

Our industrial solutions cover a wide range of semiconductor manufacturing needs:

Die Bonder & Wire Bonding
Laser Marking (ID IC Wafer)
Laser Grooving & Cutting
Glass Ceramics Wafers Packaging
Laser Internal Modification (Si/Sic/Lt/Ln)
Laser Annealing Machine
Automatic Dicing Saw
Silicone Dispensing Equipment

Packaging & Shipping

Frequently Asked Questions

Q1: How do I choose the most suitable machine for my needs?

You can provide us with the workpiece material, size, and required functions. Based on our experience, we will recommend the most suitable configuration for your application.

Q2: What is the warranty period for this marking equipment?

We provide a one-year warranty along with 24-hour online professional technical support to ensure your production remains uninterrupted.

Q3: Which wafer sizes are compatible with your machines?

Our machines support a wide range of wafer sizes, including 2-inch, 4-inch, 6-inch, 8-inch, and 12-inch wafers, depending on the specific model chosen (HDZ-WAF500 or HDZ-WAF600).

Q4: Does the system support automated production lines?

Yes, the system features fully-automatic loading and unloading and can be integrated into high-efficiency automated production environments.

Q5: What types of laser sources can be configured?

Depending on your marking requirements, we offer UV lasers, Green lasers, CO2 lasers, and Fiber lasers to achieve the best results on different materials.

Q6: Is the software interface easy to use for non-native speakers?

Yes, our self-developed software operates on a standard Windows platform and features a complete English interface for easy global operation.