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1. Marking of electronic products' LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
| Machine model | EP-15/25/30-THG-S |
| Laser wavelength | 355nm |
| Laser power | 4W / 7W / 10W /15W / 25W |
| Min. marking line width | 10µm-15µm |
| Marking speed | 250 characters/sec |
| Marking scope | 100*100mm |
| Standard lens | F160 |
| Pulse repetition frequency | 10-200kHz |
| Cooling mode | Water cooling |
| Total power consumption | ≤1.5kW |


Specializing in the international trade and integration of semiconductor industry equipment. Our equipment is exported to over 30 countries, serving over 200 customers and suppliers globally. We focus on providing cost-effective products including Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting, and Automatic Silicone Dispensing Equipment.
