High-Speed Laser IC Marking System for Efficient Production

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High-Speed Laser IC Marking System for Efficient Production

Customization:	Available
After-sales Service:	Provided
Warranty:	12 Months

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Product Description

Basic Information

Model NO.	LG-01
Laser Visibility	Visible
Applicable Material	Metal
Cooling System	Air Cooling
Technical Class	Continuous Wave Laser
Laser Wavelength	Fiber Laser
Laser Classification	Semiconductor Laser
Type	YAG Laser Marking Machine
Marking Method	Scanning Marking
Product Name	Laser IC Marking Equipment
Feature 1	High Precision
Feature 2	High Efficiency
Origin	China

Product Description

Laser IC Marking Equipment Support Lot End Printing Clearance Function

Equipment Features:

Support MES Mark module system for seamless integration.
Mark Auto download capability.
Automatic generation of printing information.
Supports high-precision Mark 2D functionality.
Automatically read Mapping to distinguish printing defects.
Support LOT END printing clearance function.
Support scanning to replace text dynamically.
Automatic text alignment with fixed text width.

No.	Feature	Description
1	MES Mark Module System	Supports integration with Manufacturing Execution Systems (MES) for traceability.
2	Mark Auto Download	Automatically downloads marking data from connected systems.
3	Automatic Printing Info Generation	Dynamically generates printing content (serial numbers, dates) without manual input.
4	2D Mark Functionality	Capable of printing high-precision 2D codes (e.g., QR, DataMatrix) for tracking.
5	Automatic Mapping & Defect Detection	Uses mapping technology to identify and flag printing defects.

Key Applications

Semiconductor IC marking: Ideal for chip serialization and branding.
Electronics traceability: High-speed 2D code marking for anti-counterfeiting.
Automated production lines: Full MES integration for real-time industrial data processing.

Performance & Industry Presence

Our solutions cover a wide range of semiconductor equipment needs including Die Bonders, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, and Laser Cutting for glass and ceramic wafers. We focus on delivering high-efficiency automated silicone dispensing and dicing solutions to global partners.

Packaging & Shipping

Standard wooden box packaging or customized export solutions to ensure equipment safety during transit.

FAQ

Q1: How to choose a suitable machine? A1: You can provide the working piece material, size, and specific function requirements. We will recommend the most suitable configuration based on our industry experience.

Q2: What is the warranty period for the equipment? A2: We offer a one-year warranty along with 24-hour online professional technical support to ensure your production never stops.

Q3: Do you support OEM/ODM services? A3: Yes, we provide full OEM, ODM, and specialized designing services to meet unique production line requirements.

Q4: Can the system integrate with existing MES? A4: Absolutely. The equipment supports the MES Mark module system for automated data synchronization and traceability.

Q5: What is the typical lead time for standard models? A5: Standard specifications usually have a streamlined production cycle. Contact us for the current schedule based on your configuration.

Q6: Is on-site training provided? A6: We provide comprehensive technical documentation, video guides, and remote support. On-site technical assistance can be arranged upon request.