High-Precision UV Laser Marking System for PCB Applications

Customization: Available
After-sales Service: Provided
Warranty: Provided

Product Description

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Basic Information
Model NO.
EP-15-THG-S
Laser Visibility
Visible
Applicable Material
Metal
Cooling System
Air Cooling
Technical Class
Continuous Wave Laser
Laser Wavelength
Fiber Laser
Laser Classification
Semiconductor Laser
Type
YAG Laser Marking Machine
Marking Method
Scanning Marking
Product Name
UV Laser Marking
Origin
China
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Product Description
UV Laser Marking System

Brief Description

  • Marking of electronic products' LOGO, model, place of origin and so on.
  • Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on).
  • Micro-hole drilling with diameter d≤10μm.
  • High precision PCB marking and cutting applications.

Key Features

  • Cold laser processing with small heat-affected zone for high quality results.
  • Wide applicable materials range compensating for infrared laser limitations.
  • Superior beam quality and small focusing spot for superfine marking.
  • High marking speed, efficiency, and precision.
  • Zero consumables, providing low cost and maintenance fees.
  • Stable performance supporting long-term industrial operation.
Marking Sample 1
Marking Sample 2
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Technical Specifications
Machine modelEP-15/25/30-THG-S
Laser wavelength355nm
Laser power4W / 7W / 10W /15W / 25W
Min. marking line width10µm-15µm
Marking speed250 characters/sec
Marking scope100*100mm
Standard lensF160
Pulse repetition frequency10-200kHz
Cooling modeWater cooling
Power supplyAC 220V, 50Hz, 16A
Total power consumption≤1.5kW
Overall dimension800mm*950mm*1630mm
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Exhibition & Product Range
Exhibition View
Customer Interaction

Our solutions are currently exported to over 30 countries, serving more than 200 customers and suppliers globally. We aim to provide the most cost-effective semiconductor and laser equipment while ensuring risk avoidance and quality assurance.

Main Product Line: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines, Automatic Dicing Saws, and Automatic Silicone Dispensing Equipment.

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Packaging & Shipping
Professional Packaging
Frequently Asked Questions
How to choose a suitable machine?
You can share your working piece material, size, and required machine functions with us. We will recommend the most suitable configuration based on our extensive industry experience.
What is the warranty period for the equipment?
We provide a one-year warranty along with 24-hour online professional technical support to ensure your production remains uninterrupted.
What materials are best suited for UV laser marking?
UV lasers are ideal for materials sensitive to heat, such as various plastics (PVC, HDPE, PP), electronic components, glass, and certain metals, as they offer "cold" marking.
Does the machine require frequent maintenance or consumables?
No, our UV laser marking systems are designed for low maintenance and require no consumables, which significantly reduces long-term operational costs.
Can this machine be used for PCB cutting?
Yes, the high precision and small focusing spot of our UV laser make it excellent for both marking and specialized micro-cutting on PCB materials.
What is the cooling method used in these systems?
The system utilizes advanced water cooling to maintain stable performance during long-term industrial operations, as specified in our technical charts.

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