High-Precision UV Laser Marking System for Circuit Board Etching

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High-Precision UV Laser Marking System for Circuit Board Etching

Customization:	Available
After-sales Service:	Provided
Warranty:	Provided

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Product Description

ℹ️ Basic Information

Model NO.

FB-01

Laser Visibility

Visible

Applicable Material

Metal

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Laser Wavelength

UV Laser, CO2 Laser

Laser Classification

Semiconductor Laser

Type

YAG Laser Marking Machine

Marking Method

Scanning Marking

Product Name

PCBA & IC & Wafer Marking Machine

Origin

China

📦 Product Description

Brief Description

Applicable for the packaged IC marking of DIP, QFN and BGA.

Key Features

Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser output, direction inspection function of intelligent vision system, sampling inspection function of marking effect.
Friendly HMI interface for easy operation.
Imported double-head 20W fiber laser marking system; optional green laser, UV laser, CO2 laser and other laser sources.
Special fume removal device to quickly extract fume and dust, protecting the marking environment.
Fully complies with CE MARK and SEMI standards.

📋 Technical Specifications

Parameter	HDZ-SIC100	HDZ-SIC200
Marking scope	320mm*160mm	320mm*160mm
Product specification	L: 160-320mm; W: 30-80mm	L: 160-320mm; W: 30-80mm
Font	TFT and SHX; with font library module modification program
Repeated positioning precision	±0.1mm	±0.1mm
UPH (Idle)	1200 pieces/h	1200 pieces/h
Power supply	AC 220V, 50/60Hz	AC 220V, 50/60Hz
Air source	0.6-0.8 MPa	0.6-0.8 MPa
Overall dimension	2525mm1665mm2000mm	2515mm1420mm2000mm

🤝 Exhibition & Customers

Established in 2019, the core focus remains on international trade and integration of semiconductor industry equipment. The equipment is currently exported to over 30 countries, serving over 200 customers and suppliers globally, aimed at providing high-precision, cost-effective industrial solutions.

Main product lines include: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines, Laser Annealing, and Automatic Dicing Saw Machines.

🚢 Packaging & Shipping

❓ Frequently Asked Questions

Q1: How to choose a suitable marking machine?

A: You can provide us with the workpiece material, size, and specific function requirements. Based on our extensive experience, we will recommend the most suitable configuration for your needs.

Q2: What is the warranty period for the equipment?

A: We provide a one-year warranty along with 24-hour online professional technical support to ensure your operations run smoothly.

Q3: What materials are suitable for this laser marking machine?

A: This equipment is primarily designed for high-precision marking on metals and semiconductor components like ICs (DIP, QFN, BGA), wafers, and PCBA.

Q4: Does the machine support customized features?

A: Yes, the machine can be customized according to specific production needs, including different laser sources like UV, CO2, or Fiber lasers.

Q5: What cooling system is utilized in the FB-01 model?

A: The system uses a reliable Air Cooling system, which is efficient for maintaining optimal operating temperatures during continuous marking processes.

Q6: Does the equipment comply with international safety standards?

A: Yes, all our marking machines comply with CE MARK and SEMI standards, ensuring high quality and safety for global industrial use.