High-Precision UV Laser Marking System for Food Packaging Solutions

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High-Precision UV Laser Marking System for Food Packaging Solutions

Customization:	Available
After-sales Service:	Provided
Warranty:	Provided

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Product Description

Basic Info

Model NO.

EP-15-THG-S

Laser Visibility

Visible

Applicable Material

Metal

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Laser Wavelength

Fiber Laser

Laser Classification

Semiconductor Laser

Type

YAG Laser Marking Machine

Marking Method

Scanning Marking

Product Name

UV Laser Marking

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

Origin

China

Production Capacity

100

Product Description

Brief Description

Marking of electronic products' LOGO, model, place of origin, and more.
Marking of food packaging, PVC pipes, and medicine materials (HDPE, PO, PP, etc.).
High-precision micro-hole drilling (diameter d≤10μm).
Professional PCB marking and cutting applications.

Key Features

Cold Laser Processing: Small heat-affected zone for high-quality results.
Material Versatility: Compensates for infrared laser processing limitations.
Superior Beam Quality: Small focusing spot for superfine marking.
Efficiency: High marking speed and exceptional precision.
Low Operating Cost: No consumables and minimal maintenance fees.
Stable Performance: Reliable for long-term industrial operations.

Specifications

Machine model	EP-15/25/30-THG-S
Laser wavelength	355nm
Laser power	4W / 7W / 10W / 15W / 25W
Min. marking line width	10µm-15µm
Marking speed	250 characters/sec
Marking scope	100*100mm
Standard lens	F160
Pulse repetition frequency	10-200kHz
Cooling mode	Water cooling
Power supply	AC 220V, 50Hz, 16A
Total power consumption	≤1.5kW
Overall dimension	800mm950mm1630mm

Exhibition & Capabilities

Our solutions focus on high-cost-effective semiconductor and laser equipment. We serve customers globally across 30 countries, providing integrated solutions for international trade and industrial needs.

Main Product Categories:

Die Bonders & Wire Bonding Systems
Laser Marking (ID IC Wafer) & Laser Grooving
Laser Cutting (Glass Ceramics Wafers Packaging)
Laser Annealing & Internal Modification Machines (Si/Sic/Lt/Ln)
Automatic Dicing Saw & Silicone Dispensing Equipment

Packaging & Shipping

Frequently Asked Questions

Q1: How do I choose the most suitable machine?

A1: Please provide us with your material type, workpiece size, and required functions. Based on our extensive experience, we will recommend the optimal configuration for your specific needs.

Q2: What is the warranty and technical support period?

A2: We offer a comprehensive one-year warranty on our equipment, complemented by 24-hour online professional technical support to ensure your production never stops.

Q3: What materials are compatible with UV laser marking?

A3: UV lasers are ideal for materials sensitive to heat, including most plastics (HDPE, PO, PP), glass, certain metals, PCB boards, and electronic components where high-precision marking is required.

Q4: Does the machine require expensive consumables?

A4: No. Our laser marking machines are designed for high efficiency with zero consumables, resulting in very low daily operating costs and minimal maintenance requirements.

Q5: Can the marking scope and power be customized?

A5: Yes, we offer various power levels (4W to 25W) and can adjust configurations based on your specific application requirements.

Q6: How is the equipment protected during international shipping?

A6: We use specialized wooden box packaging designed for international transport to ensure the precision equipment arrives safely at your destination without damage.