Advanced High-Volume PCBA Marking System for Streamlined Manufacturing

Customization:	Available
After-sales Service:	Provided
Warranty:	12 Months

1

Basic Information

Model NO.

HDZ-SIC200

Laser Visibility

Visible

Applicable Material

Metal

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Laser Wavelength

UV Laser, CO2 Laser

Laser Classification

Semiconductor Laser

Type

YAG Laser Marking Machine

Product Name

PCBA & IC & Wafer Marking Machine

Feature

High Precision & Efficiency

Origin

China

2

Product Description

Fully-Automatic Loading and Unloading PCBA & IC & Wafer Marking Machine

Applicable for the packaged IC marking of DIP, QFN and BGA. This high-volume system is designed for streamlined manufacturing environments requiring extreme precision.

Key Features

Fully-automatic loading and unloading from hanging basket to hanging basket with stable laser output.
Intelligent vision system for direction inspection and marking effect sampling.
User-friendly Human-Machine Interface (HMI).
Imported double-head 20W fiber laser marking system (Green, UV, CO2 lasers optional).
Integrated special fume removal device for environment protection.
Compliant with CE MARK and SEMI standards.

3

Technical Specifications

Machine Model	HDZ-SIC100	HDZ-SIC200
Marking Scope	320mm*160mm	320mm*160mm
Product Specification (L*W)	160-320mm * 30-80mm	160-320mm * 30-80mm
Font Library	TFT and SHX with modification program
Repeated Positioning Precision	±0.1mm	±0.1mm
UPH (Units Per Hour)	1200 pieces/h (idle)	1200 pieces/h (idle)
Power Supply	AC 220V, 50/60Hz	AC 220V, 50/60Hz
Dimensions	252516652000mm	251514202000mm

4

Global Presence & Products

Expertise in international trade and semiconductor industry equipment integration, serving over 30 countries globally. We focus on high cost-effective solutions for semiconductor manufacturing.

Core Product Range: Die Bonder, Wire Bonding, Laser Marking (IC/Wafer), Laser Grooving, Laser Cutting (Glass/Ceramics), Internal Modification (Si/SiC/Lt/Ln), Laser Annealing, and Automatic Dicing Saw Machines.

5

Packaging & Shipping

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Frequently Asked Questions

How to choose a suitable machine?

You can provide the workpiece material, size, and the required functions. We will recommend the most suitable machine based on your specific industrial needs.

What is the warranty period for the equipment?

We offer a one-year warranty along with 24-hour online professional technical support to ensure your production remains uninterrupted.

What types of laser sources are available?

The system supports multiple laser sources including Fiber, Green laser, UV laser, and CO2 laser to accommodate different material requirements.

What is the production efficiency (UPH) of this marking machine?

The machine reaches a UPH of up to 1200 pieces per hour under idle conditions, ensuring high efficiency for semiconductor packaging lines.

Does the machine comply with international safety standards?

Yes, our equipment is fully compliant with both CE MARK and SEMI standards, meeting global safety and industry requirements.

Is there a solution for the smoke generated during laser marking?

The machine is equipped with a specialized fume removal device that quickly extracts smoke and dust to protect the marking environment and operator health.