Precision Laser Marking Systems for Circuit Packaging Solutions

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Precision Laser Marking Systems for Circuit Packaging Solutions

Customization:	Available
After-sales Service:	Provided
Warranty:	12 Months

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Product Description

Basic Info

Model NO.FB-04

Laser VisibilityVisible

Applicable MaterialMetal

Cooling SystemAir Cooling

Technical ClassContinuous Wave Laser

Laser WavelengthUV Laser, CO2 Laser

TypeYAG Laser Marking Machine

Marking MethodScanning Marking

Product NamePCBA & IC & Wafer Marking Machine

FeaturesHigh Precision, High Efficiency

OriginChina

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Product Description

UV Laser/CO2 Laser Marking Machine for The Packaged IC Marking

Applicable for the packaged IC marking of DIP, QFN and BGA. This system provides precision marking solutions for high-density circuit packaging environments.

Key Features:

Fully-automatic loading and unloading from hanging basket to hanging basket with stable laser output.
Direction inspection function of intelligent vision system and sampling inspection for marking effects.
Friendly HMI (Human-Machine Interface) for easy operation.
Imported double-head 20W fiber laser marking system (Optional: Green, UV, or CO2 laser sources).
Integrated special fume removal device to extract smoke and dust quickly, protecting the environment.
Full compliance with CE MARK and SEMI standards.

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Specifications

Machine Model	HDZ-SIC100	HDZ-SIC200
Marking Scope	320mm * 160mm	320mm * 160mm
Product Specification	L: 160-320mm; W: 30-80mm	L: 160-320mm; W: 30-80mm
Font Support	TFT and SHX; with font library module modification program
Positioning Precision	±0.1mm	±0.1mm
UPH	1200 pieces/h (idle)	1200 pieces/h (idle)
Power Supply	AC 220V, 50/60Hz	AC 220V, 50/60Hz
Air Source	0.6-0.8 MPa	0.6-0.8 MPa
Overall Dimension	2525mm1665mm2000mm	2515mm1420mm2000mm

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Exhibition & Customers

Specializing in international trade and integration of semiconductor industry equipment. The equipment is currently utilized in over 30 countries with a vast network of global customers and suppliers.

Main Product Portfolio: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines (Si /Sic, Lt/Ln Wafers), Laser Annealing Machines, and Automatic Dicing Saw Machines.

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Packaging & Shipping

Frequently Asked Questions

How to choose a suitable machine?

You can share your workpiece material, dimensions, and required functional specifications. Based on our experience, we will recommend the most efficient model for your production needs.

What is the warranty period for the equipment?

We provide a standard one-year warranty along with 24-hour online professional technical support to ensure your operations remain uninterrupted.

What materials can this machine mark?

This system is specifically optimized for semiconductor materials, including IC packages (DIP, QFN, BGA), PCBA, and various metal surfaces.

Does the machine support custom laser sources?

Yes, while the standard configuration uses a 20W fiber laser, we offer optional UV, CO2, and Green laser sources to meet specific material marking requirements.

Are your machines compliant with international standards?

Absolutely. All our laser marking systems comply with CE MARK and SEMI industrial standards for safety and performance.

Do you provide OEM/ODM services?

Yes, we provide comprehensive OEM, ODM, and custom designing services to integrate our marking systems into your existing production lines.