Advanced Precision Marking Solutions for PCBA and IC Production

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Advanced Precision Marking Solutions for PCBA and IC Production

Customization:	Available
After-sales Service:	Provided
Warranty:	Provided

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Product Description

Basic Information

Product Name

PCBA & IC & Wafer Marking Machine

Applicable Material

Metal, FPC, Rigid PCB

Laser Wavelength

UV Laser, CO2 Laser, Fiber

Laser Visibility

Visible

Laser Classification

Semiconductor Laser

Origin

China

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Product Description

Advanced PCBA & IC & Wafer Marking Machine

Specialized marking solution designed for digital products, wearable devices, automobile PCBA, mobile phone PCBA, and FPC. This high-precision system ensures reliable tracking and branding for both rigid and flexible printed circuit boards.

Core Capabilities

✔ Supports 1D barcodes, 2D Matrix, QR codes, logos, and batch number marking.
✔ Fully-automatic loading and unloading system for stable output.
✔ Intelligent vision system for direction and sampling inspection.
✔ Multiple laser sources available: Fiber, Green, UV, and CO2.
✔ Built-in fume removal device to protect the working environment.
✔ Full compliance with CE MARK and SEMI standards.

Technical Specifications

Machine Model	HDZ-SIC100	HDZ-SIC200
Marking Scope	320mm * 160mm	320mm * 160mm
Product Spec (L*W)	160-320mm; 30-80mm	160-320mm; 30-80mm
Font Support	TFT and SHX with font library module
Positioning Precision	±0.1mm	±0.1mm
UPH (Idle)	1200 pieces/h	1200 pieces/h
Power Supply	AC 220V, 50/60Hz	AC 220V, 50/60Hz
Dimension	2525 * 1665 * 2000mm	2515 * 1420 * 2000mm

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Industry Expertise

With extensive experience in semiconductor industry equipment, we provide integration and trade services to over 30 countries and 200+ global partners. Our focus remains on high cost-effective solutions and risk avoidance for all supply chain stages.

Beyond laser marking (ID IC Wafer), our main product range includes Die Bonders, Wire Bonding, Laser Grooving, Laser Cutting for Glass/Ceramics, Laser Internal Modification for Si/Sic Wafers, and Automatic Dicing Saw Machines.

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Packaging & Shipping

Frequently Asked Questions

How to choose a suitable machine?

You can share your work piece material, size, and required machine functions. Based on our experience, we will recommend the most suitable configuration for your production needs.

What is the warranty period for the equipment?

We provide a one-year warranty and 24-hour online professional technical support to ensure your operations run smoothly.

What types of laser sources do you offer?

Depending on the application, we offer Fiber laser, UV laser, CO2 laser, and Green laser sources to achieve the best marking results on different materials.

Does the machine support custom logos and QR codes?

Yes, the software supports 1D barcodes, 2D Data Matrix, QR codes, logos, and variable batch numbers for full traceability.

Is the loading and unloading process automated?

Yes, the machine features fully-automatic loading and unloading from hanging basket to hanging basket, which significantly improves UPH and stability.

Why choose our marking solutions?

We provide OEM/ODM and custom design services, ensuring high precision (±0.1mm) and compliance with international CE and SEMI safety standards.