High Quality Automatic 8-Inch/12-Inch Green Laser or UV Laser Wafer Marking Machine

Applicable for the 6-inch, 8-inch and 12-inch wafer marking processes with precision and high stability.

Main Features:

• Equipped with Green or UV laser for fine focusing spot and non-contact marking.
• Fully-automatic loading and unloading system with automatic edge searching.
• Computer-controlled system with English interface and self-developed easy-to-use software.
• High automation levels featuring automatic fault alarm functions.
• High-precision marking specifically designed for product DIE.

Our expertise lies in the international trade and integration of semiconductor industry equipment. Our systems are currently exported to over 30 countries, serving over 200 customers and suppliers worldwide. We aim to provide cost-effective solutions and ensure secure, high-quality procurement for the final stage of semiconductor manufacturing.

Key Product Range: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting, Laser Annealing, and Automatic Dicing Saw Machines.