• Utilizes high-power, high-stability ultraviolet lasers to directly ablate and vaporize materials, achieving a μm-level heat-affected zone and a minimum processing spot size of 5μm.
• Achieves high-speed, high-precision etching on small surfaces through precise galvanometer control of beam deflection.
• Enables large-surface precision machining through high-precision linear motor-driven platform translation.
• The Z-axis is electrically adjustable to accommodate materials of varying thicknesses, meeting the requirements for etching three-dimensional structures.
• Expands with A and C axes, suitable for machining irregularly shaped parts.
• High-resolution industrial cameras are used for full-field error correction of the galvanometer and high-precision focusing, ensuring long-term system stability and accuracy.
• Supports high-precision positioning and machining of workpieces, with built-in offset compensation functionality.
• The system employs a marble tabletop to enhance overall stability, with all mechanical components carefully selected to ensure long-term precision.
• Capable of processing metals, ceramics, organics, glass, and other materials, enabling efficient etching, blind hole drilling, through-hole drilling, slotting, and cutting.
• Minimum processing line width of 5μm, with a customizable processing range of 300*300mm.

The operational scope includes technical services, development, consulting, and technology transfer. Expertise covers computer software and hardware, sales of functional glass, new optical materials, optical instruments, and specialized equipment for semiconductor devices. Further capabilities involve experimental analysis instruments, CNC machine tools, electronic components, electromechanical equipment, metal cutting and welding equipment, fiber optics, photovoltaic components, and optical glass.

Note: Achieved after preheating for 30 minutes at a constant temperature of (25±0.5ºC).