Laser Micro-Machining System/Micro-Machining Laser/Laser System

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Laser Micro-Machining System/Micro-Machining Laser/Laser System

Customization:	Available
After-sales Service:	One Year Warranty
Warranty:	One Year Warranty

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Product Description

■ Overview & Basic Info

Model NO. AT-61157

Origin China

Package Size 50.00cm * 60.00cm * 50.00cm

Package Gross Weight 30.000kg

■ Product Description

✓ Utilizes high-power, high-stability ultraviolet lasers to directly ablate and vaporize materials, achieving a μm-level heat-affected zone and a minimum processing spot size of 5μm.

✓ Achieves high-speed, high-precision etching on small surfaces through precise galvanometer control of beam deflection.

✓ Enables large-surface precision machining through high-precision linear motor-driven platform translation.

✓ The Z-axis is electrically adjustable to accommodate materials of varying thicknesses, meeting the requirements for etching three-dimensional structures.

✓ Expands with A and C axes, suitable for machining irregularly shaped parts.

✓ High-resolution industrial cameras are used for full-field error correction of the galvanometer and high-precision focusing, ensuring long-term system stability and accuracy.

✓ Supports high-precision positioning and machining of workpieces, with built-in offset compensation functionality.

✓ The system employs a marble tabletop to enhance overall stability, with all mechanical components carefully selected to ensure long-term precision.

✓ Capable of processing metals, ceramics, organics, glass, and other materials, enabling efficient etching, blind hole drilling, through-hole drilling, slotting, and cutting.

✓ Minimum processing line width of 5μm, with a customizable processing range of 300*300mm.

■ Product Applications

● Semiconductor flexible circuit board cutting
● ITO film layer etching
● Microelectronic device manufacturing

● Printing template preparation
● Biochip preparation
● Precision micro-mold forming

■ Scope of Services

Technical services, technology development, technology consulting, technology exchange, technology transfer, technology promotion: computer Wholesale of software, hardware, and auxiliary equipment: Retail of computer software, hardware, and auxiliary equipment: Import and export of goods: Import and export of technology: Credit Information consulting services (excluding licensing information consulting services): graphic and textual design and production: sales of functional glass and new optical materials Selling; Sales of optical instruments; Sales of specialized equipment for semiconductor devices: sales of experimental analysis instruments: sales of CNC machine tools: sales of instruments Sales of instruments and meters; Sales of electronic components and electromechanical equipment; Sales of metal cutting and welding equipment; Fiber optic sales; Sales of photovoltaic equipment and components; Sales of optical glass; Sales of electronic specialized materials.

■ Product Parameters

Category	Parameter	FM-UVM20A	FM-UVM20B
Laser	Wavelength	355nm	355nm
Laser	Power	20W (3~40W optional)	20W (3~40W optional)
Laser	Modulation Frequency	1~200kHz	1~200kHz
Laser	Pulse Width	15ns@40kHz	15ns@40kHz
Laser	Beam Quality M²	<1.2	<1.2
Galvanometer	Scan Range	<50*50mm	<15*15mm
Galvanometer	Repeatability	<1μm	<1μm
Galvanometer	Positioning Accuracy	≤±3μm	≤±3μm
XY Stage	Travel	300300mm (500400mm optional)	300300mm (500400mm optional)
XY Stage	Repeatability	≤±1μm	≤±1μm
Z Axis	Travel	150mm	150mm
CCD Positioning	Camera	5-megapixel	5-megapixel
Processing	Minimum Spot Size	8μm	5μm
Processing	3D Etching	Supported	Supported
Processing	System Accuracy	±5μm	±5μm
Processing	Materials	Glass, organics, metals, etc.	Glass, organics, metals, etc.
Power	Consumption	≤2000W	≤2000W
Dimensions	Size	120015001900mm	120015001900mm
Weight	Total Weight	1200Kg	1200Kg

Note: Achieved after preheating for 30 minutes at a constant temperature of (25±0.5ºC).

■ Detailed Photos

? Frequently Asked Questions

1. What materials can this laser micro-machining system process?

The system is highly versatile and capable of processing metals, ceramics, organic materials, glass, and more. It is ideal for etching, blind hole drilling, through-hole drilling, slotting, and precision cutting.

2. What is the minimum processing line width and spot size?

The system can achieve a minimum processing line width of 5μm. Depending on the model, the minimum processing spot size ranges between 5μm and 8μm.

3. Does the system support 3D structure etching?

Yes, the Z-axis is electrically adjustable to accommodate materials of varying thicknesses, making it fully capable of meeting requirements for etching complex three-dimensional structures.

4. How does the system ensure long-term stability and accuracy?

The system utilizes a high-stability marble tabletop and carefully selected mechanical components. Additionally, high-resolution industrial cameras provide full-field error correction and high-precision focusing.

5. Can the processing range be customized?

Yes, while the standard processing range is 300*300mm, it can be customized to 500*400mm or other ranges based on specific client requirements.

6. What type of cooling and maintenance does the system require?

The system uses a water-cooling method for the laser source. It also features a triple dust purification system for extraction, ensuring a clean and safe working environment.