The UV series products are highly versatile and can be effectively utilized on most materials for standard 3rd level flight marking. This technology is particularly advantageous for specialized materials such as plastics, PE Bottles, packaging bags, and PVC pipe lines. It is also extensively used for high-speed data communication marking applications.
| Item | Parameter Specification |
|---|---|
| Wavelength | 355nm |
| Power | ≥5W |
| Working Frequency | 8-200KHz |
| Minimum Code Width | 0.15mm |
| Minimum Character Size | 0.40mm |
| Repeatability Accuracy | ±0.01mm |
| Standard Marking Range | 100mm × 100mm |
| Nominal Line Speed | ≥10000mm/s |
| Printing Code | >700 Chars/Sec |
| Power Requirement | AC 220V/50HZ/10A |
| Cooling Mode | Thermostat water cooling |
| Protection Level | IP54 |
| Main Beam Size | 611.5mm × 162mm × 189mm |


Our business is deeply engaged in international trade and the integration of semiconductor industry equipment. Our equipment is currently exported to over 30 countries, serving over 200 customers and suppliers worldwide. We aim to provide the most cost-effective products and ensure risk avoidance for our partners.
Main product categories include: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting, and Automatic Dicing Saw Machines.