Advanced Three-Axis Laser Processing System for Precision Manufacturing

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Advanced Three-Axis Laser Processing System for Precision Manufacturing

Customization:	Available
After-sales Service:	One Year Warranty
Warranty:	One Year Warranty

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Product Description

Overview

Model NO.

AT-61167

Origin

China

Package Size

150.00cm * 90.00cm * 150.00cm

Gross Weight

2000.000kg

Product Description

The three-axis laser processing system is a high-performance device specifically designed for industrial precision manufacturing. It integrates high-power fiber laser technology, precision motion control, and intelligent software systems to achieve high-precision etching, drilling, slotting, and cutting of materials such as metals and ceramics. It is widely applied in fields such as consumer electronics and microelectronic device manufacturing.

Product Features

Dual-mode Processing Technology High-speed Galvanometer Scanning for precision etching in small areas; Precision Platform Movement using a separated gantry XY platform for large areas; Z-axis Electric Adjustment for varying material thicknesses.

High-precision Capabilities Minimum 20μm spot size for minute features; Micron-level positioning for consistency; Optional off-axis visual positioning for large-area precision stitching.

Wide Material Adaptability Compatible with metals (Stainless steel, aluminum, titanium), ceramics (Alumina, zirconia), and semiconductor materials.

Industrial-grade Reliability Designed for 24/7 continuous operation with modular components for easy maintenance and a comprehensive cooling system.

Product Applications

Consumer ElectronicsMobile phone components, camera modules, and circuit board marking.

InstrumentationInternal structural components for precision instruments and medical devices.

MicroelectronicsSemiconductor packaging and MEMS device microstructure fabrication.

Mold FormingTexture processing for precision molds and surface strengthening treatment.

Technical Parameters

Category	Parameter	FM-SD50 Value
Laser	Wavelength	1064 nm
Laser	Power	50W
Laser	Modulation Frequency	40~1000kHz
Galvanometer	Scanning Range	<50*50mm
Galvanometer	Repeatability	<1μm
XY Worktable	Stroke	300*300mm (customizable)
XY Worktable	Positioning Accuracy	≤±20μm
Z-axis	Stroke	200mm
Capability	Minimum Hole Diameter	20μm
Capability	Processing Thickness	≤1mm
Cooling	Cooling Method	Air Cooling
Power	Power Supply	220V 50~60Hz 12A
Dimensions	Machine Size	1000 * 1000 * 1700mm

Service Scope

Technical services and technology development focused on optical instruments, semiconductor device specialized equipment, experimental analysis instruments, and CNC machine tools. We specialize in the sales and optimization of metal cutting and welding equipment, fiber optics, photovoltaic components, and electronic specialized materials.

Detailed Photos

Frequently Asked Questions

1. What materials are compatible with this three-axis laser system?

The system is highly adaptable, processing metals (stainless steel, titanium, aluminum), ceramics (alumina, zirconia), and various semiconductor materials or silicon wafers.

2. What is the minimum processing feature size achievable?

The system utilizes a high-precision beam that can achieve a minimum spot size and hole diameter of 20μm, making it ideal for micro-manufacturing.

3. Does the system require a complex cooling environment?

No, the FM-SD50 model is equipped with an efficient air-cooling system, which simplifies installation and reduces the maintenance requirements compared to water-cooled systems.

4. Can this machine handle 24/7 industrial production?

Yes, all components are industrial-grade and carefully selected to meet the rigorous demands of continuous 24/7 operation with long-term precision stability.

5. What are the main processing functions of this system?

The system is multi-functional, capable of high-precision etching, micro-drilling (blind and through-holes), micro-slotting, and clean edge cutting.

6. How is processing accuracy maintained over large areas?

Accuracy is maintained through a combination of high-speed galvanometer scanning for small areas and a precision XY gantry platform movement for larger areas, with micron-level positioning.